Zyxel-communications Multi-service Access Platform MSAP2000 Instrukcja Użytkownika Pobierz pdf (Strona 167)

7. Product Specification

MSAP2000 Technical Manual V3.0 7-60

GSH Specification

Microprocessor Winbond W90N740

Flash ROM Flash EPROM(1MB)

Hardware

RAM SRAM (2MB)

G.SHDSL Interface Line Code 16 Leel TC PAM (TC PAM 16)

Symbol Rate

Frame

(Data Rate+8000)/3 Symbol/sec

Complies with ITU-T G.991.2

Standards

Test Impedance 135Ω, Resistance

Handshake Standard Complies with ITU-T G.991.2

and ITU-T G.994.1 Standards

Loopback Testing Local Loopback

Remote Loopback

Remote Payload Loopback

Input Power 5VDC/1.4A

-48VDC/20mA (Sealing)

Power

Consumption

4W@25°C

Environment Operation Temperature and

0°C to +60°C

Humidity Up to 95% relative humidity

Storage Temperature and -10°C to +80°C

Humidity Up to 95% relative humidity

Height 213 ± 1mm

Width 18 ± 1mm

Depth 257 ± 1mm

Dimension

Weight 356 ± 2 g

EMI CNS 13438 or CISPR 22

ESD IEC 61000-4-2 Class 1

1 2 ... 162 163 164 165 166 167 168 169 170 171 172 ... 242 243

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Zyxel-communications Multi-service Access Platform MSAP2000 Instrukcja Użytkownika Strona 167